Offer Description Reference:Public notice no *******/PDF/CoolbrainA tender is hereby opened for the award of onePostdoctoral Fellowshipunder the project COOLBRAIN – CHIPLET COOLING SOLUTIONS FOR LOW-CONSUMPTION EMBEDDED PROCESSING AI AT NANOSCALE (HORIZON-EU-*********) at the University of Aveiro / DETI.Scientific Area Condensed Matter Physics, Light-Matter Interaction, Radiative Heat Transfer.Admission Requirements Doctor Degree in Electrical Engineering, Physics, Applied Physics, Physical Engineering, or a related field.Other RequirementsStrong background in multidisciplinary theoretical and applied physics, including solid state physics and light–matter interactions, electromagnetics of metamaterials, physics of radiative heat transfer, and multiphysics simulation methods.Solid expertise in electromagnetic modeling of nanostructured media such as metamaterials and metasurfaces, particularly at infrared frequencies.Experience in analytical and numerical modeling of near-field radiative heat transfer and thermophotovoltaic (TPV) systems based on such systems.Experience with semiconductor device modeling, especially TPV cells involving low-bandgap and III-V semiconductors.Scientific publication record relevant to the topic of the project.Eligibility Applicants are eligible if they obtained a doctorate less than three years prior and satisfy the provisions of the Research Fellow Statute and the University of Aveiro regulations.Work Plan The selected researcher will develop analytical and numerical models for near-field radiative heat transfer between closely spaced nanostructured media, including metamaterials, metasurfaces, carbon nanotube arrays, and metallic and semiconductor nanostructures.
The work will include modeling and optimization of super-Planckian RHT and related energy recycling and photoelectric conversion mechanisms.
Particular emphasis will be placed on electromagnetic and thermal modeling of low-bandgap semiconductor TPV systems and on optimizing emitter–receiver geometries to enhance heat transfer and conversion efficiency.
The researcher will also contribute to the development of multiphysics simulation frameworks that combine electromagnetic, thermal, and semiconductor device models to design advanced energy harvesting solutions at the chip level.Benefits Duration: 6 months (starting July ****, renewable).
Amount of monthly maintenance allowance: €*****,00.#J-*****-Ljbffr