Company Description
The Bosch Group has more than employees around the world, present in 60 countries, and we are proud to impact people's lives and to work towards a more sustainable future.
Bosch Car Multimedia, S.A. belongs to the Automotive Electronics division and is focused on making the vehicles our third living space. About 3.600 associates are committed to develop and produce high quality technology that shape change in mobility worldwide. The company' success lies in its highly specialized and innovative team, and on the technological know-how which makes Bosch the leading supplier in the automotive market.
At Bosch, we shape the future by inventing high-quality technologies and services that spark enthusiasm and enrich people's lives. Our promise to our associates is rock-solid: we grow together, we enjoy our work, and we inspire each other. Join in and feel the difference in mindsets, cultures, generations, identities and perspectives. Everyone should bring their authenticity and work together respectfully. Bosch is an employer that values diversity and equal opportunities. We welcome applications from people with disabilities and we can provide reasonable accommodations during the recruitment process and in the performance of professional activity. By including everyone and ensuring equal opportunities we unleash our full potential.
Job Description
Your contribution to something big:
- Background / Current situation:
* SIP (System in Packages) modules becoming widely used at Bosch in different products. This technology presents a higher complexity, compared to the standard BGA packages due to the large sizes, and CTE mismatch activated at high temperatures. These special characteristics are leading to new failure modes caused by different failure mechanisms, not deeply studied so far, such as, pad cratering, non-wetting, hot tear, etc.
- Scope:
1. Understand the failure mechanisms caused by thermal-mechanical loads;
2. Understand the interactions between different material/design combinations;
3. Understand the manufacturing impact (process parameters - special focus on reflow process);
4. Creation of design rules for SIP components capable to mitigate these failure mechanisms;
5. Simulation tools to support on the load path effect.
- Test Planning Proposal:
1. Literature and Bosch SIP documents review;
2. Data collection from different Bosch Plants;
3. Use of MBE model (Model Based Engineering) for a comprehensive study on thermal-mechanical mecanisms and influence of design parameters;
4. Propose of design elements and manufacturing solutions based on previous investigations;
5. Use of simulation tools to predict and support design decision.
Qualifications
What distinguishes you:
- Academic Background: Mechanic or Materials Engineering.
- Desired Competencies and Profile:
1. Advanced knowlege on material properties. Focus on thermal-mechanical damages;
2. Experimental Design and Data Analysis: Basic knowledge of experimental planning and data analysis, including statistical treatment, with interest in strengthening these skills through practical application;
3. Problem-Solving and Critical Thinking: Analytical mindset with the ability to approach complex physical phenomena in a structured manner and develop technically sound solutions;
4. Good presentation skills;
5. Team work;
6. Fluent in English (written, verbal, technical communication).
Additional Information
Work #LikeABosch includes:
Exchange with colleagues around the world
Health insurance
Medical office (psychology and general clinic) & Social Services Office on site
Training opportunities (p.e., technical training, foreign languages training)
Continuous professional development
Access to great discounts in partnerships and Bosch products
Sports and health related activities
Great access to public transports
Free transport from Porto
Free parking lot
Canteen
Success stories don´t just happen. They are made...
Make it happen We are looking forward to your application